THIN FILM CIRCUIT DEVICE

PURPOSE:To make it possible to manufacture the device at a high yield rate, by coating thin film elements formed on the surface of a substrate by an insulating resin. CONSTITUTION:The thin film elements 2, 3, and 4 are formed on the surface of an insulating substrate 1, and a thin film conductor 4&#...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	FUJI MASAAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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