THIN FILM CIRCUIT DEVICE

PURPOSE:To make it possible to manufacture the device at a high yield rate, by coating thin film elements formed on the surface of a substrate by an insulating resin. CONSTITUTION:The thin film elements 2, 3, and 4 are formed on the surface of an insulating substrate 1, and a thin film conductor 4&#...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	FUJI MASAAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To make it possible to manufacture the device at a high yield rate, by coating thin film elements formed on the surface of a substrate by an insulating resin. CONSTITUTION:The thin film elements 2, 3, and 4 are formed on the surface of an insulating substrate 1, and a thin film conductor 4' is formed on the back surface. Thereafter, a semiconductor chip and the like are attached. Then the circuits on the top and back surfaces of the substrate 1 are electrically connected, and the thin film elements 2, 3, and 4, a which are formed on the top surface of the substrate 1, are coated by the insulating resin 5. Thus the damage due to flaws and the like on the thin film elements in the attachment of the IC to the back surface of the substrate and the like can be prevented.