ELECTROPLATING DEVICE

PURPOSE:To change electric current density and to make the ratio of plating alloys constant in a device for removing gases generated from electrodes by injecting liquid to electrode surfaces by covering a part of an anode according to the distributions in the velocity of flow of the liquid thereby c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ANAMI TATSUROU, HIRONO TADAO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PURPOSE:To change electric current density and to make the ratio of plating alloys constant in a device for removing gases generated from electrodes by injecting liquid to electrode surfaces by covering a part of an anode according to the distributions in the velocity of flow of the liquid thereby changing the surface area thereof. CONSTITUTION:A plating soln. is ejected from a jet discharge port 1, and the gases generated from the surface of an anode 2 are removed. A part of the anode 2 is covered by an insulating seal 3 provided on the anode 2, by which the velocity of flow on the surface of the anode 2 on the port 1 side is increased, the bath resistance is decreased and current density is increased. In the part on the opposite side, the velocity of flow is decreased and the current density is reduced. Therefore, the change in alloy ratios caused by the velocity of plating flow is offset by the change in the current density, and the alloy ratios are made uniform.