RESIN COMPOSITION FOR LAMINATE

PURPOSE:The titled resin composition providing a cured material having extremely low change of color by heating in a gas, obtained by adding a high ortho-phenol formaldehyde resin as a curing agent to an epoxy compound. CONSTITUTION:(A) An epoxy compound having two or more epoxy groups in a molecule...

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Hauptverfasser: YOSHIMURA YUKIO, YASUZAWA KOUHEI, IWABUCHI SHINJI
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creator YOSHIMURA YUKIO
YASUZAWA KOUHEI
IWABUCHI SHINJI
description PURPOSE:The titled resin composition providing a cured material having extremely low change of color by heating in a gas, obtained by adding a high ortho-phenol formaldehyde resin as a curing agent to an epoxy compound. CONSTITUTION:(A) An epoxy compound having two or more epoxy groups in a molecule is blended with (B) a high ortho-phenol formaldehyde resin[having an ortho ratio shown by the formula (infrared spectrum) of >=70%]as a curing agent in amounts to give preferably 0.9-1.2 equivalent phoenolic hydroxy group per equivalent epoxy group, to give the desired composition. If necessary, a curing promotor, e.g., benzyldimethylamine etc., a solvent, e.g., methyl ethyl ketone, etc. are added to the blend, which is impregnated into glass cloth, carbon fiber cloth, etc. as a base for laminated and cured. USE:A copper-clad laminate, etc. for forming circuit, etc.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
title RESIN COMPOSITION FOR LAMINATE
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