RESIN COMPOSITION FOR LAMINATE

PURPOSE:The titled resin composition providing a cured material having extremely low change of color by heating in a gas, obtained by adding a high ortho-phenol formaldehyde resin as a curing agent to an epoxy compound. CONSTITUTION:(A) An epoxy compound having two or more epoxy groups in a molecule...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOSHIMURA YUKIO, YASUZAWA KOUHEI, IWABUCHI SHINJI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:The titled resin composition providing a cured material having extremely low change of color by heating in a gas, obtained by adding a high ortho-phenol formaldehyde resin as a curing agent to an epoxy compound. CONSTITUTION:(A) An epoxy compound having two or more epoxy groups in a molecule is blended with (B) a high ortho-phenol formaldehyde resin[having an ortho ratio shown by the formula (infrared spectrum) of >=70%]as a curing agent in amounts to give preferably 0.9-1.2 equivalent phoenolic hydroxy group per equivalent epoxy group, to give the desired composition. If necessary, a curing promotor, e.g., benzyldimethylamine etc., a solvent, e.g., methyl ethyl ketone, etc. are added to the blend, which is impregnated into glass cloth, carbon fiber cloth, etc. as a base for laminated and cured. USE:A copper-clad laminate, etc. for forming circuit, etc.