PHOTOSEMICONDUCTOR DEVICE
PURPOSE:To improve the adherence between a supporting substrate and an enclosure by forming the bonding surface of both the substrate and the enclosure in recessed or projected structure. CONSTITUTION:Leads 12, 13 are secured to a ceramic supporting substrate 15, light emitting element or photodetec...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | PURPOSE:To improve the adherence between a supporting substrate and an enclosure by forming the bonding surface of both the substrate and the enclosure in recessed or projected structure. CONSTITUTION:Leads 12, 13 are secured to a ceramic supporting substrate 15, light emitting element or photodetector 11 are mounted at the end of a lead 12, and the end of the lead 13 is connected via a wire 14. A recess 17a is formed on the upper outer periphery of a substrate 15, and a projected part 17b is formed on the lower outer periphery of the enclosure 6 to engaged. Accordingly, the adherence can be extremely preferably improved. |
|---|