SEMICONDUCTOR PRESSURE SENSOR

PURPOSE:To enable the formation of a gauge part and a control circuit part on the same substrate, which results in improving productivity, by a method wherein a gauge is placed in a manner to close a perforation in the substrate whereon the control circuit is formed, and the gauge is sealed with a c...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NAKAZAWA TERUMI, MINORIKAWA HITOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To enable the formation of a gauge part and a control circuit part on the same substrate, which results in improving productivity, by a method wherein a gauge is placed in a manner to close a perforation in the substrate whereon the control circuit is formed, and the gauge is sealed with a cap having a vent hole. CONSTITUTION:A gauge 6 is located in a manner to close a perforation 3A provided in a substrate 3, and a control circuit, connected to the gauge 6, is formed on the substrate 3. Additionally, a cap 8, having a vent hole 8A and sealing the gauge 6, is placed, and is filled with a chip coating agent 10 for coating the gauge 6, the control circuit on the substrate 3 being coated with a substrate coating agent. For example, a ceramic substrate 3, in which the control circuit consists of an IC chip 11, is placed in a case 2, the gauge 6 is placed over the perforation 3A through a toroidal glass stand 5, and a semiconductor pressure sensor 1 is formed in a manner as described above.