DRY ETCHING DEVICE

PURPOSE:To reduce difference of etching speed within an object to be processed, by a method wherein a gas outlet port of a gas supply tube is disposed near the center of the object, and gas and reactive product are flowed from the center towards the outer circumference. CONSTITUTION:An electrode table 19 to hold an object 27 thereon is arranged through an insulator 16 to the center of a processing chamber 15 shielded tightly, and a high-frequency source 26 is connected to the table 19. An electrode 21 is opposed to the table 19. Exhaust tubes 24, 25 are arranged at the center of the processing chamber 15 and at inside of the outer edge portion. An etching gas supply tube 23 is formed in ring between the electrode 21 and the object 27, and a gas outlet port is arranged in a position opposed to the center of the object 27. Etching gas is blown from the gas outlet port towards the center of the object 27, and flowed to the outer circumference of the object 27 while etching it and then discharged out of the exhaust tubes 24, 25.