ADHESIVE COMPOSITION

PURPOSE:To provide an adhesive compsn. having excellent heat resistance and flexibility and suitable for use in the production of flexible printed circuit boards, by blending a modified epichlorohydrin rubber, an acrylic compd. and a polymn. initiator. CONSTITUTION:10-95wt% alkyl glycidyl ether copo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KATOU MASAHISA, TOMONAGA KAZUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE:To provide an adhesive compsn. having excellent heat resistance and flexibility and suitable for use in the production of flexible printed circuit boards, by blending a modified epichlorohydrin rubber, an acrylic compd. and a polymn. initiator. CONSTITUTION:10-95wt% alkyl glycidyl ether copolymerized-modified epichlorohydrin rubber (A) such as Zechlon 1,100, 90-5wt% acrylic compd. (B) such as (meth)acrylic acid or 2-hydroxyethyl (meth)acrylate and 0.1-5pts.wt. (per 100pts. wt. of the combined amount of A and B) polymn. initiator (C) are blended together to obtain an adhesive compsn.