INVERTING METHOD FOR ELECTRONIC PARTS

INVERTING METHOD FOR ELECTRONIC PARTS

PURPOSE:To accelerate a soldering by adsorbing one lead wire with a permanent magnet when solder is covered on the end of the lead wire of a diode from which the lead wire is projected in an opposite direction from an enclosure, dipping the other lead wire in a solder tank, rotating it at 180 deg. w...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KATSUKI HIROTO, KUBO TOMONORI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KATSUKI HIROTO
KUBO TOMONORI
description PURPOSE:To accelerate a soldering by adsorbing one lead wire with a permanent magnet when solder is covered on the end of the lead wire of a diode from which the lead wire is projected in an opposite direction from an enclosure, dipping the other lead wire in a solder tank, rotating it at 180 deg. with an electromagnetic coil and again dipping it. CONSTITUTION:One side lead wires 1a of diodes 1 from which pairs of lead 1, 1b are projected from an enclosure are adsorbed to and suspended from the lower surface of a permanent magnet 5, which is then lowered to dip the ends of the lead wires 1b in molten solder 6 of a solder tank 6', thereby covering the solder thereon. Thereafter, the magnet 5 is pulled up, many diodes 1 are inserted into an electromagnetic coil 7, and are adsorbed thereto, the magnet 5 is removed, the coil 7 is rotated at 180 deg., the lead wires 1b thus soldered and rotated to upside are again adsorbed to the magnet 5, and similar soldering is performed at the lead wires 1a disposed at the downside.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS57170545A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS57170545A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS57170545A3</originalsourceid><addsrcrecordid>eNrjZFD19AtzDQrx9HNX8HUN8fB3UXDzD1Jw9XF1Dgny9_N0VghwDAoJ5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BwabmhuYGpiamjsbEqAEAtQ0juA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INVERTING METHOD FOR ELECTRONIC PARTS</title><source>esp@cenet</source><creator>KATSUKI HIROTO ; KUBO TOMONORI</creator><creatorcontrib>KATSUKI HIROTO ; KUBO TOMONORI</creatorcontrib><description>PURPOSE:To accelerate a soldering by adsorbing one lead wire with a permanent magnet when solder is covered on the end of the lead wire of a diode from which the lead wire is projected in an opposite direction from an enclosure, dipping the other lead wire in a solder tank, rotating it at 180 deg. with an electromagnetic coil and again dipping it. CONSTITUTION:One side lead wires 1a of diodes 1 from which pairs of lead 1, 1b are projected from an enclosure are adsorbed to and suspended from the lower surface of a permanent magnet 5, which is then lowered to dip the ends of the lead wires 1b in molten solder 6 of a solder tank 6', thereby covering the solder thereon. Thereafter, the magnet 5 is pulled up, many diodes 1 are inserted into an electromagnetic coil 7, and are adsorbed thereto, the magnet 5 is removed, the coil 7 is rotated at 180 deg., the lead wires 1b thus soldered and rotated to upside are again adsorbed to the magnet 5, and similar soldering is performed at the lead wires 1a disposed at the downside.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1982</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19821020&amp;DB=EPODOC&amp;CC=JP&amp;NR=S57170545A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19821020&amp;DB=EPODOC&amp;CC=JP&amp;NR=S57170545A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KATSUKI HIROTO</creatorcontrib><creatorcontrib>KUBO TOMONORI</creatorcontrib><title>INVERTING METHOD FOR ELECTRONIC PARTS</title><description>PURPOSE:To accelerate a soldering by adsorbing one lead wire with a permanent magnet when solder is covered on the end of the lead wire of a diode from which the lead wire is projected in an opposite direction from an enclosure, dipping the other lead wire in a solder tank, rotating it at 180 deg. with an electromagnetic coil and again dipping it. CONSTITUTION:One side lead wires 1a of diodes 1 from which pairs of lead 1, 1b are projected from an enclosure are adsorbed to and suspended from the lower surface of a permanent magnet 5, which is then lowered to dip the ends of the lead wires 1b in molten solder 6 of a solder tank 6', thereby covering the solder thereon. Thereafter, the magnet 5 is pulled up, many diodes 1 are inserted into an electromagnetic coil 7, and are adsorbed thereto, the magnet 5 is removed, the coil 7 is rotated at 180 deg., the lead wires 1b thus soldered and rotated to upside are again adsorbed to the magnet 5, and similar soldering is performed at the lead wires 1a disposed at the downside.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1982</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD19AtzDQrx9HNX8HUN8fB3UXDzD1Jw9XF1Dgny9_N0VghwDAoJ5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BwabmhuYGpiamjsbEqAEAtQ0juA</recordid><startdate>19821020</startdate><enddate>19821020</enddate><creator>KATSUKI HIROTO</creator><creator>KUBO TOMONORI</creator><scope>EVB</scope></search><sort><creationdate>19821020</creationdate><title>INVERTING METHOD FOR ELECTRONIC PARTS</title><author>KATSUKI HIROTO ; KUBO TOMONORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS57170545A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1982</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KATSUKI HIROTO</creatorcontrib><creatorcontrib>KUBO TOMONORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KATSUKI HIROTO</au><au>KUBO TOMONORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INVERTING METHOD FOR ELECTRONIC PARTS</title><date>1982-10-20</date><risdate>1982</risdate><abstract>PURPOSE:To accelerate a soldering by adsorbing one lead wire with a permanent magnet when solder is covered on the end of the lead wire of a diode from which the lead wire is projected in an opposite direction from an enclosure, dipping the other lead wire in a solder tank, rotating it at 180 deg. with an electromagnetic coil and again dipping it. CONSTITUTION:One side lead wires 1a of diodes 1 from which pairs of lead 1, 1b are projected from an enclosure are adsorbed to and suspended from the lower surface of a permanent magnet 5, which is then lowered to dip the ends of the lead wires 1b in molten solder 6 of a solder tank 6', thereby covering the solder thereon. Thereafter, the magnet 5 is pulled up, many diodes 1 are inserted into an electromagnetic coil 7, and are adsorbed thereto, the magnet 5 is removed, the coil 7 is rotated at 180 deg., the lead wires 1b thus soldered and rotated to upside are again adsorbed to the magnet 5, and similar soldering is performed at the lead wires 1a disposed at the downside.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPS57170545A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title INVERTING METHOD FOR ELECTRONIC PARTS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T18%3A53%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KATSUKI%20HIROTO&rft.date=1982-10-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPS57170545A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true