INVERTING METHOD FOR ELECTRONIC PARTS

PURPOSE:To accelerate a soldering by adsorbing one lead wire with a permanent magnet when solder is covered on the end of the lead wire of a diode from which the lead wire is projected in an opposite direction from an enclosure, dipping the other lead wire in a solder tank, rotating it at 180 deg. with an electromagnetic coil and again dipping it. CONSTITUTION:One side lead wires 1a of diodes 1 from which pairs of lead 1, 1b are projected from an enclosure are adsorbed to and suspended from the lower surface of a permanent magnet 5, which is then lowered to dip the ends of the lead wires 1b in molten solder 6 of a solder tank 6', thereby covering the solder thereon. Thereafter, the magnet 5 is pulled up, many diodes 1 are inserted into an electromagnetic coil 7, and are adsorbed thereto, the magnet 5 is removed, the coil 7 is rotated at 180 deg., the lead wires 1b thus soldered and rotated to upside are again adsorbed to the magnet 5, and similar soldering is performed at the lead wires 1a disposed at the downside.