THICK FILM PRINTED CIRCUIT BOARD

PURPOSE:To obtain preferable bonding property and migration resistant property without expensive Au by forming a wire bonding film used when an element mounted on a substrate is wire bonded of a metallic layer by two types of thick film printings. CONSTITUTION:An earth electrode 11 and a wire 11a ar...

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Bibliographische Detailangaben
1. Verfasser:	EDA SHIGEO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain preferable bonding property and migration resistant property without expensive Au by forming a wire bonding film used when an element mounted on a substrate is wire bonded of a metallic layer by two types of thick film printings. CONSTITUTION:An earth electrode 11 and a wire 11a are continuously printed in a thick film on a substrate 10 made of ceramics, synthetic resin or the like, and wire bonding films 12, 15 are formed in the vicinity of both sides of the electrodes 11. In this structure, to form the films 12, 15, AgPd having good migration resistant property and conductivity is used to print in a thick film square first films 13, 16, and second films 14, 17 such as Ag, Cu having not so good migration resistant property but good bonding property are formed therein in slightly small size. In this manner, a chip-shaped transistor element 18 is secured onto the electrode 11, and is connected via lead wires 20, 21 to the films 14, 17.