MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To increase the adhesive strength of a bump by forming a window onto a substrate, to which an electrode and a protective film are shaped, while using a resist as a mask, coating the substrate with a barrier metal layer, forming the bump while employing the resist as a mask and removing the unnecessary barrier metal layer. CONSTITUTION:The substrate 1 to which the Al electrode 2 and the PSG protective film 3 are shaped is coated with a photo-resist 6, and the window for a bump base forming region 9 is molded. The surface is coated with the barrier layer such as Cr4 and Au5. The photo-resist 6 is applied again, a window for a bump forming region 7 smaller than the bump base forming region 9 is formed, and a bump electrode 8 is shaped. Photo-resists 106, 6 and a unnecessary barrier metal are removed. Accordingly, the etching treatment of the barrier metal layer is unnecessitated, and the adhesive strength is improved.