CURABLE RESIN COMPOSITION

PURPOSE:To prepare a curable resin composition having excellent workability and useful as an electrical insulating material, by compounding an acid anhydride, an epoxy resin, a curing catalyst comprising a specific aluminum complex, and a cure accelerator comprising a specific organic silicon compou...

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Bibliographische Detailangaben
Hauptverfasser:	HAYASE SHIYUUJI, SUZUKI SHIYUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To prepare a curable resin composition having excellent workability and useful as an electrical insulating material, by compounding an acid anhydride, an epoxy resin, a curing catalyst comprising a specific aluminum complex, and a cure accelerator comprising a specific organic silicon compound. CONSTITUTION:The objective composition is prepared by compounding (A) 100pts.wt. of an epoxy resin (e.g. bisphenol A-type epoxy resin) with (B) 10- 90pts. of an acid anhydride (e.g. phthalic anhydride), (C) 0.0001-5pts. of an aluminum complex having at least one beta-keto ester as a ligand (e.g. trisethylacetoacetato-aluminum) and (D) 0.0001-5pts. of an organic silicon compound having at least one hydrolyzable group bonded directly to silicon atom[e.g. triphenyl(methoxy)-silane]. EFFECT:It has excellent electrical properties and crack resistance, and high storage stability.