MANUFACTURE OF SEMICONDUCTOR DEVICE FOR MEMORY

PURPOSE:To prevent the exfoliation of a cover body resulting from the difference of the thermal expansion coefficient of a ceramic package for a memory cell, which can be erased by ultraviolet rays, and the cover body by using transparent alumina or sapphire as the cover body. CONSTITUTION:A conductor layer 2 is disposed to the inside and extending over the outside from the inside of the ceramic package 1, and lead wires 3 are connected to the external conductor layer 2. A FAMOS semiconductor cell 6 is mounted into the package 1, and the package 1 is sealed by the cover 4 consisting of a transparent alumina board or sapphire board of materials, through which the ultraviolet rays are transmitted sufficiently and the thermal expansion coefficient thereof is approximately the same as the package. Low melting point glass 5, which is made of a non-permeable material and expansion and contraction thereof are little, is used as adhesives in order to fix the cover 4. The exfoliation of the cover resulting from the difference of the thermal expansion coefficient is not generated because the thermal expansion coefficient of the cover 4 and the package 1 approximately equal.