REACTIVE ADHESIVE CONTAINING BRON COMPOUND

Polymerizable adhesives mixtures containing ethylenic double bonds capable of polymerizing and boron compounds as polymerization initiators, wherein the boron compounds are organoboron compounds and contain at least one boron-carbon bond or one boron-hydrogen bond and have practically no spontaneous...

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Hauptverfasser: UERUNERU GURUUBERU, UORUFUGANGU RITSUTERU
Format: Patent
Sprache:eng
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Zusammenfassung:Polymerizable adhesives mixtures containing ethylenic double bonds capable of polymerizing and boron compounds as polymerization initiators, wherein the boron compounds are organoboron compounds and contain at least one boron-carbon bond or one boron-hydrogen bond and have practically no spontaneous combustibility in air. The adhesives harden after a short time to give stable adhesive bonds, even in the presence of moisture.