CONTROL OF PLATING ADHESION AMOUNT

PURPOSE:To control a turn-round amount to an exposed surface when one surface is plated to a minimum degree in carrying out continuous electroplating of a strip, by providing a first and a second barrier plates specifically to make a plating adhesion amount uniform. CONSTITUTION:In continuously electroplating a strip 1 by using an anode 4 and a plating liquid with a liquid surface 5, in the vicinity of the anode 4 provided to both side end parts of the strip 1, a first electrically insulative barrier plate 2 is arranged almost in parallel therewith. In order to further improve barrier effect, a second barrier plate 3 almost parallel with the plate 2 is arranged. When the plate 3 is positioned at a height same as that of the strip, maximum barrier effect is obtained but it may be positioned a little closer to the side of the anode 4 and, as it is brought closer to the plate 2, said effect is reduced. In plating both surfaces of the strip 1, if a distance between both plates 3 is narrow, effect perfectly same with that when one plate is used is obtained. Further, in plating one side of the strip 1, at each side surfaces, one plate may be used but, if two plates are used, both surface plating can be carried out.