PRODUCTION OF LEAD FRAME FOR IC

PURPOSE:To facilitate flash removal work by varying the total quantity of light to expose photo resist through a photo mask between both surfaces and forming a lead frame of a taper-etched section.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YAHAGI SEIJI, SHIMADA KAZUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To facilitate flash removal work by varying the total quantity of light to expose photo resist through a photo mask between both surfaces and forming a lead frame of a taper-etched section.