JPS511540

A hot melt adhesive composition, which comprises: a modified ethylene-vinyl acetate copolymer produced by heating a mixture of 99.7 - 20 parts by wt. of an ethylene-vinyl acetate copolymer having a vinyl content of 5 - 50 wt. % and a melt index of 1 - 400 g/10 min., 0.3 - 80 parts by wt. of an unsat...

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Bibliographische Detailangaben
Hauptverfasser:	KOSAKA JUJIRO, WATANABE SHUZO, EMURA TOKUAKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A hot melt adhesive composition, which comprises: a modified ethylene-vinyl acetate copolymer produced by heating a mixture of 99.7 - 20 parts by wt. of an ethylene-vinyl acetate copolymer having a vinyl content of 5 - 50 wt. % and a melt index of 1 - 400 g/10 min., 0.3 - 80 parts by wt. of an unsaturated alkyd resin produced by esterification of an unsaturated acid and a polyhydric alcohol and 0.05 - 5 parts by wt. of an organic peroxide.