MANUFACTURING METHOD OF SEMI CONDUCTOR

PURPOSE:Protect from a breaking of wire by evaporating the low temperature melt metal on the electrode contact window and then head add softening it and constituting the inclination surface of low melting point metal ranged to insulating material in the contact window.

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Bibliographische Detailangaben
Hauptverfasser:	TABATA YUTAKA, MAKABE KUNIAKI, MANO TOORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:Protect from a breaking of wire by evaporating the low temperature melt metal on the electrode contact window and then head add softening it and constituting the inclination surface of low melting point metal ranged to insulating material in the contact window.