MODULE PART

MODULE PART

PROBLEM TO BE SOLVED: To provide a module part, wherein sufficient ground connection is possible between a module part and a mother board, related to a module part used for a high-frequency part of a radio communication device. SOLUTION: When a module board 11 is mounted on a motherboard 13, second...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SASAKI TAKESHI, HASHIMOTO KOJI, HACHIMAN KAZUHIRO, TSUNEOKA MICHIO, IKEDA TADAYUKI
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a module part, wherein sufficient ground connection is possible between a module part and a mother board, related to a module part used for a high-frequency part of a radio communication device. SOLUTION: When a module board 11 is mounted on a motherboard 13, second projections 12a', 12b', and 12c' provided on a shield case 12 are inserted in through-holes 13a, 13b, and 13c connected electrically to a ground of the motherboard 13 for electrical connection, thus a firmer and surer ground connection is established.