MANUFACTURE OF PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To obtain a printed wiring board in which a metal copper layer having a string adhesive force is formed on an insulating board by a method, wherein a circuit pattern is printed on the insulating board by using an ink containing a specific component, the surface of the insulating board is heated at a specific temperature, the surface of the insulating board is activated, and the insulating board is immersed in an electroless copper plating bath. SOLUTION: The composition of an ink is constituted basically of 0.05 to 5 wt.% of an organic palladium dichloride complex compound, of 1 to 40 wt.% of an anhydrotrimellitic acid/polyisocyanate initial condensation product, of 1 to 40 wt.% of polyisocyanate of 5 to 40 wt.% of a filler (for viscosity adjustment) and of 30 to 90 wt.% of an organic solvent. By using ink which contains these components and which has an electroless plating activation action, a circuit pattern is printed on an insulating board. In addition, the surface of the printed insulating board is heated at a temperature in a range of 200 to 350 deg.C, and the surface of the insulating board to which the ink is fixed and bonded is activated. After that, the insulating board is immersed in an electroless copper plating bath, and a copper circuit is formed.