APPARATUS FOR CUTTING TIE BARS OF SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To unload a semiconductor package by air pressure by jetting air at a specified pressure on one side end of a semiconductor package separated from a lead frame for unloading the package. SOLUTION: An apparatus comprises a support die 268 corresponding to a guide track 266, air...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BOKU HOUSEI, KO SHIYUNEI, SAI EISHIN, KIN SHOGEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND CUTTING TOOLS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL SEMICONDUCTOR DEVICES SEVERING TRANSPORTING WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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