APPARATUS FOR CUTTING TIE BARS OF SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To unload a semiconductor package by air pressure by jetting air at a specified pressure on one side end of a semiconductor package separated from a lead frame for unloading the package. SOLUTION: An apparatus comprises a support die 268 corresponding to a guide track 266, air...

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Hauptverfasser:	BOKU HOUSEI, KO SHIYUNEI, SAI EISHIN, KIN SHOGEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND CUTTING TOOLS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL SEMICONDUCTOR DEVICES SEVERING TRANSPORTING WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To unload a semiconductor package by air pressure by jetting air at a specified pressure on one side end of a semiconductor package separated from a lead frame for unloading the package. SOLUTION: An apparatus comprises a support die 268 corresponding to a guide track 266, air jet unit 265 at one side of the die 268 for continuously jetting air at specified pressure on one side end of a semiconductor package for moving the package separated from a lead frame strip to the guide track 266, and punch 269 housing the semiconductor package. Both side ends of the punch 269 are opened to jet air from a tube 274 to continuously press the one side end of the package, and when the opened parts of the punch 269 align with the guide track 266, the package is moved to this track due to the jetted air to unload it to a semiconductor package storing tube.