LUBRICANT COMPOSITION FOR WATER-SOLUBLE METAL PROCESSING

PROBLEM TO BE SOLVED: To obtain the subject composition having a combination of chip dispersibility and defoamability by including a specific aromatic diamine- polyoxyalkylene adduct and/or specific alicyclic diamine-polyoxyalkylene adduct. SOLUTION: This composition is obtained by including pref. 1...

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Hauptverfasser: WAKASHIRO SHIYOUJI, NAKAJIMA TAKASHI, OGINO KYOKO, OKUGAWA MICHIHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To obtain the subject composition having a combination of chip dispersibility and defoamability by including a specific aromatic diamine- polyoxyalkylene adduct and/or specific alicyclic diamine-polyoxyalkylene adduct. SOLUTION: This composition is obtained by including pref. 1.5-40 wt.% of an aromatic diamine polyoxyalkylene adduct of formula I [R to R are each H or (A)m -H; A is an oxyalkylene or polyoxyalkylene; (m) and (n) are each >=1] and/or an alicyclic diamine polyoxyalkylene adduct of formula II; wherein the (poly)oxyalkylene is pref. oxyethylene and/or oxypropylene, the addition number of moles being pref. 1-4. The compound(s) of formula I and/or formula II is incorporated pref. at 0.005-0.2 wt.% in a coolant.