COMPOSITION FOR POLISHING

PROBLEM TO BE SOLVED: To obtain a composition for polishing, having a high polishing rate and capable of forming a polished surface excellent in uniformity. SOLUTION: This composition for polishing comprises (1) water, (2) a polishing material, (3) at least one anion selected from the group consisti...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUMURA SATOSHI, TAMAI KAZUMASA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a composition for polishing, having a high polishing rate and capable of forming a polished surface excellent in uniformity. SOLUTION: This composition for polishing comprises (1) water, (2) a polishing material, (3) at least one anion selected from the group consisting of nitrate, nitrite, chloride, perchlorate, chlorate, chlorite, hypochlorite, borate, perborate, sulfate, sulfite, persulfate, phosphate, phosphite, hypophosphite, silicate, organic acid radicals and ions of the hydroacids thereof or a mixture thereof and (4) at least one cation selected from the group consisting of ammonium ions, alkali metallic ions and alkaline earth metallic ions. In this case, the total amount of the cation (4) is 0.001-0.15 mol/L.