COLLECTOR ELECTRODE, WAFER TRANSFER DEVICE, SEMICONDUCTOR CLEANING APPARATUS, AND REACTION CORE CLEANING APPARATUS

PROBLEM TO BE SOLVED: To utilize batch cleaning of semiconductor wafers using thermal electron emission in a high-temperature oven, a reactor or a quick heat tool by forming collector electrodes of semiconductor wafers having surface which is either unpolished, roughened or oxidized. SOLUTION: Collector electrodes are separate semiconductor wafers 120 connected to a collector voltage source Vc. Therefore, the collector wafers 120 receive impurities contaminated wafers 122 to be cleaned. Collector wafers 120 may be processed or unprocessed, and it is also preferable that its surface should be roughened or oxidized. The collector wafers 120 are placed between the contaminated wafers 122 in a comb-like manner. In the transfer apparatus, the collector wafers 120 are connected with the collector voltage source Vc, and the contaminated wafers 122 are connected with a wafer voltage source Vb. The wafer voltage source Vb is more electropositive than Vc.