BONDING STRUCTURE

PROBLEM TO BE SOLVED: To reduce heat stress caused by a difference in coefficient of thermal expansion by forming a recessed section with varied depth on the bonding surface of a fixing member and forming an adhesive layer in this recessed section. SOLUTION: A fixing member 11 has beam parts 12 and a recessed section 13 for forming an adhesive layer. A fixed member 14 having a coefficient of thermal expansion different from that of the fixing member 11 is bonded on the fixing member 11 through an adhesive (adhesive layer 13). For example, epoxy adhesive can be used as the adhesive, and this kind of adhesive has the cushioning property. This adhesive layer 13 reduces heat stress caused by a difference in coefficient of thermal expansion and prevents defective bonding between the fixing member 11 and the fixed member 14. Heat stress can be further properly reduced by forming the recessed section 13 so as to be deeper on the outside than a central part thereof, that is, to be deeper in the direction in which acting stress increases.