POLISHING DEVICE AND METHOD

PROBLEM TO BE SOLVED: To sufficiently hold the polishing speed and wafer uniformity by feeding chemical slurry to a spray means, by letting the slurry to pass through an opening, and by providing a presser means for forming the spray to be provided on the surface of the polishing pad. SOLUTION: Slur...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATTHEW K MILLER, TIMOTHY S CHAMBERLAIN, ERIC G WALTON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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