POLISHING DEVICE AND METHOD

PROBLEM TO BE SOLVED: To sufficiently hold the polishing speed and wafer uniformity by feeding chemical slurry to a spray means, by letting the slurry to pass through an opening, and by providing a presser means for forming the spray to be provided on the surface of the polishing pad. SOLUTION: Slur...

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Bibliographische Detailangaben
Hauptverfasser:	MATTHEW K MILLER, TIMOTHY S CHAMBERLAIN, ERIC G WALTON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To sufficiently hold the polishing speed and wafer uniformity by feeding chemical slurry to a spray means, by letting the slurry to pass through an opening, and by providing a presser means for forming the spray to be provided on the surface of the polishing pad. SOLUTION: Slurry is fed to the surface of a polishing pad 13 by a spray means 32 during polishing, injected or pressed in open holes in the polishing pad 13, and forms a slurry layer on a pad surface. The spray means 32 is provided with an entrance 33 for feeding the slurry. The slurry is pressed out from nozzles 35 as a form of the spray or the splash 34 under the pressure from the spray means 32. The spray pressure applied on the chemical slurry spray and the pad 13 allows the spray to cover the front face of the pad 13 and also to be pressed into the holes in the pad 13.