APPARATUS AND METHOD FOR PUNCHING

PROBLEM TO BE SOLVED: To enhance a forming efficiency of a via hole or productivity of a laminated chip component in the case of forming many via holes at a green sheet for constituting the component. SOLUTION: An upper mallet 3 is dropped to engage two punch parts 3a with respective die parts 2a of...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ISHINO AKIO, SAITO HIDEAKI, MURAKAMI IKKAN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To enhance a forming efficiency of a via hole or productivity of a laminated chip component in the case of forming many via holes at a green sheet for constituting the component. SOLUTION: An upper mallet 3 is dropped to engage two punch parts 3a with respective die parts 2a of a mortar 2 in the state that a green sheet 1 is placed on a mortar 2. Thereafter, the mallet 3 is raised, and the parts 2a are drawn from a punched part 3a. Thus, two via holes 5 are simultaneously formed at the sheet 1. Then, the two holes are formed by one hit (one reciprocating operation of the mallet 3).