SLURRY CIRCULATING DEVICE AND WIRE SAW USING IT

PROBLEM TO BE SOLVED: To prevent possibilities in which slurry in a slurry tank is to be scattered on the periphery even if the amount of slurry in the slurry tank is decreased with the progress of the machining operation. SOLUTION: In this slurry circulating device, slurry is circulated and supplie...

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Bibliographische Detailangaben
Hauptverfasser:	KATSUMATA NOBORU, KURODA KENSHO, IMOO HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent possibilities in which slurry in a slurry tank is to be scattered on the periphery even if the amount of slurry in the slurry tank is decreased with the progress of the machining operation. SOLUTION: In this slurry circulating device, slurry is circulated and supplied from a slurry tank 35 to a slurry supplying mechanism 20. Slurry in the slurry tank 35 is stirred by the rotation of a stirring blade 42. The amount of slurry in the slurry tank 35 is measured by a measuring unit 45. The rotational speed of the stirring blade 42 is set and changed according to the slurry amount measured by the measuring unit 45. Therefore, the stable stirring effect can be obtained regardless of the slurry amount.