DEVICE FOR REMOVING THIN FILM FROM SUBSTRATE EDGE

PROBLEM TO BE SOLVED: To remove undesired thin film on a substrate edge with a small suction capacity with a solvent and with efficiency through the use of a solvent discharging part which is in a sufficient size for covering the whole side of a rectangular substrate, such as an LCD substrate. SOLUT...

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Bibliographische Detailangaben
1. Verfasser:	ANAI NORIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To remove undesired thin film on a substrate edge with a small suction capacity with a solvent and with efficiency through the use of a solvent discharging part which is in a sufficient size for covering the whole side of a rectangular substrate, such as an LCD substrate. SOLUTION: A solvent tank 4 is placed on the top of a base 3, which is U-shaped with rectangular angles. The bottom of the tank 4 is deformed. A cylinder 5 is jointed to the deformed part. Slits are formed on the bottom and in three positions along the perimeter of the cylinder 5 in such a way that slits which are wider are disposed closer to the center of a substrate 2. A rod 51 with a slit 52 is provided in the cylinder 5. The rod 51 is rotated so as to connect the slit 52 to the three slits for increasing the amount of discharge of the solvent, while tilting the solvent discharging part 50 to the outside of the substrate 2.