METHOD FOR INJECTION MOLDING OF LIQUID CRYSTAL POLYMER AND INJECTION MOLDING

PROBLEM TO BE SOLVED: To provide a method for injection molding of liquid crystal polymer to suppress generation of a blister suitable to a molding which requires high temperature heat treating step (for about 3 to 5 min at 200 to 240 deg.C) such as solder welding or infrared reflowing. SOLUTION: In...

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Bibliographische Detailangaben
1. Verfasser:	MIWA KATSUMASA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for injection molding of liquid crystal polymer to suppress generation of a blister suitable to a molding which requires high temperature heat treating step (for about 3 to 5 min at 200 to 240 deg.C) such as solder welding or infrared reflowing. SOLUTION: In the case of injection molding of the liquid crystal polymer, the polymer is injection molded by using an injection molding machine using a screw having a screw compression ratio of 1.90 or less. And, in the case of injection molding the polymer, the polymer is injection molded with a set temperature of a rear part of a cylinder in a temperature range of (melting point -20 deg.C) to (melting point +10 deg.C) of used resin and with resin temperature injected from a nozzle in a temperature range of melting point to (melting point +25 deg.C).