METHOD OF MANUFACTURING PRINTED-CIRCUIT BOARD

PROBLEM TO BE SOLVED: To prevent discontinuous defects from occurring at a plating film which is formed at a surface connection hole in the surrounding part of the bottom part of a surface connection hole formed on the insulation resin film of a printed-circuit board, regarding a method for manufacturing the printed circuit board. SOLUTION: A process for forming a predetermined pattern on an electrode 4 by etching a copper foil being laminated on the surface of a printed-circuit board, a process for roughening the surface of the electrode 4, a process to which the surface is subjected to a treatment so that the surface becomes a light reflecting surface for reflecting light with a specific treatment liquid, a process for forming an insulating resin film for covering the electrode 4 which is subjected to the treatment, and a process for forming a surface connection hole that reaches the surface of the electrode 4 through the insulation resin film are included.