SUBSTRATE DIVIDER

PROBLEM TO BE SOLVED: To provide a device for automatically dividing an item provided with a plurality of circuit blocks on a substrate. SOLUTION: Four circuit block substrates 9 are mounted to a substrate 7. A division processing line is formed at both end of the substrate 7, and by having this pro...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MATSUMURA NOBUHITO, NONAKA TAKAHIDE
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a device for automatically dividing an item provided with a plurality of circuit blocks on a substrate. SOLUTION: Four circuit block substrates 9 are mounted to a substrate 7. A division processing line is formed at both end of the substrate 7, and by having this processing line cut off, the four circuit block substrates 9 are divided. The fed substrate 7 is pinched between a counter dowel 58 and press dowels 35, 36. Snap-off dowels 43, 44 are inserted into both ends of the substrate, and a torque and a shearing force are imparted to the snap-off dowels 43, 44 through cylinders 25, 26 and cylinders 47, 48, respectively, so that an end material of the substrate is cut off. There is provided, with a means for discriminating the kind of the substrate 7, and a program exchange is automatically carried out corresponding to the size of the substrate.