WAFER WASHING METHOD AND WAFER WASHING DEVICE

WAFER WASHING METHOD AND WAFER WASHING DEVICE

PROBLEM TO BE SOLVED: To improve washing performance, by reducing the exchange frequency of a brush and removing surface foreign matters hardly removable by scrub washing. SOLUTION: A wafer W carried into a first washing area 10 after ending a CMP(chemical machine polishing) process is successively...

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Bibliographische Detailangaben
Hauptverfasser: KURATOMI NAOYUKI, FUJITA TAKASHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To improve washing performance, by reducing the exchange frequency of a brush and removing surface foreign matters hardly removable by scrub washing. SOLUTION: A wafer W carried into a first washing area 10 after ending a CMP(chemical machine polishing) process is successively carried from the first washing area 10 to a second washing area 20 and then to a third washing area 30 by a carrying robot 41. In the first - third washing areas 10-30, roll brush washing, disk washing, megasonic jet washing and liquid chemical washing are successively executed.