SOLDER BUMP FORMATION METHOD AND MANUFACTURE OF SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a method for forming the solder bump of excellent accuracy and excellent reliability on a semiconductor element at a low cost, and the manufacturing method of a semiconductor module to which a flip chip is mounted by using it. SOLUTION: Photosensitive polyimide is co...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKASE YOSHIHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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