SOLDER BUMP FORMATION METHOD AND MANUFACTURE OF SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a method for forming the solder bump of excellent accuracy and excellent reliability on a semiconductor element at a low cost, and the manufacturing method of a semiconductor module to which a flip chip is mounted by using it. SOLUTION: Photosensitive polyimide is coated on a semiconductor wafer where a barrier metal 18 is formed and is pre-baked. Thereafter, the pattern of a first layer is exposed, curing is performed and the polyimide layer 20 of the first layer is formed. Then, the photosensitive polyimide is coated and pre-baked again, the pattern of a second layer is exposed thereafter, curing is performed and the polyimide layer 21 of the second layer is formed. Then, by filling cream solder paste 22 in the opening part of the first layer and the second layer with a squeegee by using the cream solder paste and passing it through a solder reflow furnace, solder is solidified by surface tension and a round desired solder bump 23 is formed.