WAFER TESTING METHOD

PROBLEM TO BE SOLVED: To perform wafer testing by a method without marks by computing the operating method at the minimum index from the good-product die position in the previous test, operating a prober in accordance with this operating method, and thereby obtaining the information of the die which has become good product in the entire process. SOLUTION: Whether or not the data of the same lot and the same wafer number are present in a server 4 is checked. If the data are present, the data are received from a tester 1. The optimum operating method is computed by the tester 1 from the received data. A prober 2 is operated, and the processing of the wafer test is started. Thereafter, when the coordinates of the individual die are received from the prober 2, the tester 1 determines whether or not the die has become defective until the previous test. Only when the product has been acceptable in the previous time, is the test performed. Then, the Rest results are accumulated. The test is repeated until the final die reaches from the prober 2. Thereafter, when the final die test is completed, the test result is transmitted to the server 4, and the test is completed.