WAX FOR HOT-MELT ADHESIVE AND HOT-MELT ADHESIVE COMPOSITION

PROBLEM TO BE SOLVED: To obtain a wax for a hot-melt adhesive having excellent heat- resistance adhesive while excellently maintaining cold-proof adhesion and low melt viscosity, useful in the field of book binding, by mixing a specific hot-melt adhesive with a synthetic wax. SOLUTION: This wax is o...

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Bibliographische Detailangaben
Hauptverfasser:	MUNEHISA NORIAKI, KANZAKI HIROKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a wax for a hot-melt adhesive having excellent heat- resistance adhesive while excellently maintaining cold-proof adhesion and low melt viscosity, useful in the field of book binding, by mixing a specific hot-melt adhesive with a synthetic wax. SOLUTION: This wax is obtained by mixing a hot-melt adhesive comprising preferably 100 pts.wt. of an ethylene-based copolymer and preferably 50-100 pts.wt. of a tackifier resin such as a rosin-based resin, etc., with preferably 2-100 pts.wt. of a synthetic wax such as Fischer-Tropsch wax or the like having 80-95 deg.C melting point and the ratio of weight-average molecular weight (Mw)/ number-average molecular weight (Mn) of =1% content is 30C to 70C.