IC SOCKET

PROBLEM TO BE SOLVED: To make it possible to prevent improper short-circuiting between adjacent pins, which is caused at the time of mounting of an IC socket, by a method wherein leads are implanted on a socket main body, a plurality of the leads which are provided with their connection parts with a substrate for mounting are provided on the exposed parts of the socket main body, and recesses which respectively encircle each lead are provided in the lead planted parts of the socket main body. SOLUTION: Recesses 4 provided in the joint parts of leads 2 on the rear of a socket are formed into such a form that solders 5 can stay in the recesses 5. Moreover, a flat part is formed between the recesses 4 provided in the joint parts of the adjacent leads 2 so that the flat part can be formed on the surface of a resin between the recesses 4 to contrive to partition pins in the adjacent leads 2, and the form of the recesses 4 is formed into the form of a hemisphere in consideration of easiness of the manufacture of an IC socket. As a result, the volume of the outflow of the solder 5 in the lateral direction can be reduced and an improper short-circuiting between the adjacent pins can be prevented from being generated.