METHOD FOR MOVING PARTICLE FROM ADHESIVE SHEET TO SUBSTRATE AND SEMICONDUCTOR PACKAGE MANUFACTURED BY THE SAME METHOD

METHOD FOR MOVING PARTICLE FROM ADHESIVE SHEET TO SUBSTRATE AND SEMICONDUCTOR PACKAGE MANUFACTURED BY THE SAME METHOD

PROBLEM TO BE SOLVED: To provide a method for having a particle adhere from an adhesive sheet to a substrate. SOLUTION: This method comprises a process for aligning a particle 12 adhered to an adhesive sheet 35 and a contact pad 42 of a substrate 14, a process for applying heat energy to the adhesiv...

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Bibliographische Detailangaben
1. Verfasser: GREGORY B HOTCHKISS
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for having a particle adhere from an adhesive sheet to a substrate. SOLUTION: This method comprises a process for aligning a particle 12 adhered to an adhesive sheet 35 and a contact pad 42 of a substrate 14, a process for applying heat energy to the adhesive sheet 35 while maintaining the temperature lower than the fusing point of the particle 12, and a process for peeling the adhesive sheet 35 before reflowing. The adhesive sheet 35 is able to contain adhesive coating 22 laminated on a film 24. The particles can contain various components, among which for example, solder or resin components are included.