SPINNER

PROBLEM TO BE SOLVED: To clean and dry the top and bottom surfaces of a semiconductor wafer at the same time after the wafer is polished, by gripping the outer periphery of the wafer at a plurality of positions with clamps which are rotatably supported and by providing cleaning nozzles for cleaning the top and bottom surfaces individually. SOLUTION: Three or more clamps 6 for gripping the outer periphery of a wafer are provided on the top of a rotary body 2. The rotary body 2 is rotated at relatively slow speeds, while gripping the wafer and cleaning water is jetted from cleaning water nozzles 7, 9 above and under the wafer with one or both of the nozzles 7, 9 oscillated to clean the top and bottom surfaces of the wafer. After the wafer is cleaned, the rotary body 2 is rotated at relatively high speeds, and air is jetted from the air nozzles 8, 10 for drying the top and bottom surfaces of the wafer to dry the wafer.