POLYESTER MOLDING COMPOSITION
PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition having an enhanced thermal deformation temperature or thermal sagging property, various increased low shear rheology characteristics, or the like, by compounding a specific copolymer, a specified polycarbonate, or the like. SOLUTION:...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition having an enhanced thermal deformation temperature or thermal sagging property, various increased low shear rheology characteristics, or the like, by compounding a specific copolymer, a specified polycarbonate, or the like. SOLUTION: This polyester molding composition comprises (A) an alkylene aryl polyester copolymer containing metal sulfonate salt units of formula I or the formula: (M O3 S)d -A-(OR"OH)p [(p) is 1-3; (d) is 1-3; (p)+(d)=2 to 6; (n) is 1-5; A is an aromatic ring-containing aryl; the sulfonate salt group substituents are directly bonded to the aryl ring; R" is a divalent alkyl; the metal sulfonate salt groups are bonded to the polyester through ester bonds; M is zinc or the like] and (B) an amorphous polycarbonate, a polyestercarbonate or a polyarylate polymer containing units of formula II [Ar is the divalent aromatic residue of a dicarboxylic acid (mixture); Ar' is the divalent aromatic residue of a dihydric phenol (mixture); (x) and (y) are each 0-100 mol.%]. |
---|