MANUFACTURING PROCESS OF DEVICE PROVIDED WITH METALLIZED MAGNETIC SUBSTRATE

PROBLEM TO BE SOLVED: To improve the manufacturing speed and yield of a device provided with a metallized magnetic substrate when the device is manufactured from one multilayered substrate, by making the device manufacturable by only performing one time of punching step against each green tape layer by using via holes which can be brought into contact with two facing windings. SOLUTION: Via holes 12 and 13 are individually punched through each layer at the same locations. The first punched via holes 12 and 13 can be brought into contact with two facing windings. A substrate 10 of a incombustible magnetic material is formed by laminating the layers, in such a way that the via holes 12 and 13 of the layers are respectively aligned with each other. Then the top and bottom faces of the substrate 10 are coated with a second conductive material 16 without expanding the dimensions of the via holes 12 and 13 by not performing, for example, any additional punching step for forming via holes to be connected to the via holes 12 and 13, and conductive windings are formed by connecting the side-wall coatings of the adjacent via holes 12 and 13. Finally, the substrate 10 is burnt and electroplated with an additional metal, such as copper, etc., as a conductive material.