PIEZOELECTRIC THIN FILM ELEMENT, ITS MANUFACTURE AND INK JET-TYPE RECORDING HEAD
PROBLEM TO BE SOLVED: To prevent adhesion between a protection film and a substrate from deteriorating by forming a protection layer and a base layer on the almost whole face of a substrate and forming a piezoelectric thin film on the base layer. SOLUTION: A protection layer 14 formed of platinum is...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To prevent adhesion between a protection film and a substrate from deteriorating by forming a protection layer and a base layer on the almost whole face of a substrate and forming a piezoelectric thin film on the base layer. SOLUTION: A protection layer 14 formed of platinum is formed on the whole face of a nickel electroforming substrate 12. A base layer 16 formed of titanium is formed on the whole face of the protection layer 14. Patter etching is executed so that the base layer 16 remains based on a photo-lithography method using resist. The crystal of a film formed of zirconate titanate is formed on the base layer 16. A film 18 formed of zirconate titanate is grown on the crystal by water/heat synthesis method. An individual electrode 22 is stacked/ formed on the film 18. Thus, the deterioration of adhesion between the protection layer 14 and the substrate 12 can be prevented. |
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