POSITIVE TYPE RADIATION SENSITIVE COMPOSITION AND PATTERN FORMATION USING THE SAME

PROBLEM TO BE SOLVED: To enlarge diffusion of acid in a radiation exposure area by comprising acid generator which generates acid by irradiation, high polymer wherein phenol hydroxyl group or carboxylic acid group of alkaline soluble high polymer is protected, and water generator which generates water on reacting with acid. SOLUTION: High polymer 100 pts.wt., and diphenyliodonium toluenesulfonic acid salt 5 pts.wt. wherein poly-silicon (4-vinylphenol) phenol hydroxyl group is partially protected by tetrahydropyranyl group, are dissolved in cyclohexanone, and chemical amplification positive type radiation sensitive composition solution of solid concentration of about 10 wt.% is prepared. It is filtered and a pattern formation material is obtained. After a resist film is formed and pattern-like electron beam is cast, development is carried out and a fine pattern of line distance of 0.15 μm at electronic beam irradiation amount of 10 μC/cm is formed. As a result, pattern formation of 0.2 μm or below can be carried out highly precisely.