COMPOUND WIRING MATERIAL AND PRODUCTION THEREOF

PROBLEM TO BE SOLVED: To enhance productivity, bonding stability and general purpose properties by shortening the time required for production at the time of flip-chip bonding where a wiring pattern on a substrate is bonded with a semiconductor element through a metallic material, e.g. solder. SOLUT...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	IZUMI TADAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES
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