COMPOUND WIRING MATERIAL AND PRODUCTION THEREOF

PROBLEM TO BE SOLVED: To enhance productivity, bonding stability and general purpose properties by shortening the time required for production at the time of flip-chip bonding where a wiring pattern on a substrate is bonded with a semiconductor element through a metallic material, e.g. solder. SOLUT...

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Bibliographische Detailangaben
1. Verfasser:	IZUMI TADAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enhance productivity, bonding stability and general purpose properties by shortening the time required for production at the time of flip-chip bonding where a wiring pattern on a substrate is bonded with a semiconductor element through a metallic material, e.g. solder. SOLUTION: The wiring material 1 comprises an insulating film 2 of resin material for die bonding, e.g. epoxy or polyimide, and a plurality of metal wires 3 of wiring metal, e.g. solder or gold, arranged in parallel while being supported by the insulating film 2. The metal wires 3 are exposed, by about 1/5-1/4 of the diameter thereof, from the surface and rear of the insulating film 2. The wiring material 1 is formed into a sheet or a ribbon and used while being cut freely in the lateral or longitudinal direction to include an arbitrary number and length of the metal wires 3.